Stellenanzeigen aus der Halbleiter- und Mikroelektronikbranche

Package Development Engineer


Our international client now requires a Package Development Engineer to be responsible for defining package designs for sensor systems (SIP). The role will involve liasing with customers and translating their needs into new package designs. Material selections for sensor systems will also be required. Required skills include; – Strong semiconductor packaging experience – New package knowledge including SIP (system in package) – Sensor and device knowledge – Excellent communication skills (German and English desirable) – BSc in Physics / Electronic Engineering or equivalent Please call us to discuss further