ATMI, Inc.

SDS® Gas Sources

ATMI SDS Pressure Receptacle Competent Authority Approvals and Exemptions
SDS2/SDS3 Arsine
SDS2/SDS3 Boron Trifluoride-Enriched
SDS2/SDS3 Phosphine
SDS2 Germanium Tetrafluoride
SDS2 Hydrogen Selenide
SDS3
SDS2 Phosphorus Trifluoride
SDS2 Arsenic Pentafluoride
SDS2 Silicon Tetrafluoride

VAC® Gas Sources

VAC® BF3 Isotopically Enriched
VAC® BF3 Natural Abundance
VAC® NF3
VAC® CO
VAC® Isotopically Enriched (GeF4)

High-k Gate Dielectrics

Hf13, HTB
TAETO
TDEAH, Hf15
TDMAH
TDMAS, Si35
TEMAH
TEMAS

Metal Gate Electrodes

Ru15
PDMAT
TBTDET
TiCl4

Dopants

BPTEOS
TEB
TEPO
TEASATE
TEB11
TMB
TMP
TMPO

Specialty Sub-Atmospheric Gas Packages

SAGE® Germane
SAGE® Phosphine

Gas Delivery System

TX4™

Advanced Liquid Chemical Delivery

3Chem
Bulkfill™ 1700
ProEVap™ – solids delivery for ALD (currently in Beta testing at customers)
Unichem™ 2900
VMBT System
Manually operated ampoules
Automatic operated ampoules

High-k Capacitors

Hf13, HTB
SiCl4
TAETO
TDEAH, Hf15
TDMAH
TDMAS, Si35
TEMAH
TEMAS
FeRAM

PB11
PZTG
Ti14, Ti(O-IPr)2(THD)2
Zr15, Zr(O-IPr)2(THD)2
ZtQGAdvanced Interconnect Level

Low-k Dielectrics

4MS
OMCTS

Post Etch CleansPost-Etch Residue RemovalST-250™ & ST-255™NOE and Contact CleansNOET
Contact Cleans™ – Contact Cleans I, II, IIIPhoto Resist and Organic CleansST-22™
ST-23™
ST-26S™

BarriersDEMAT
RU3(CO)12
Ru15
TaCl5
TaF5
TAIMATA
TDMAT

Electrochemical Deposition (ECD)Viaform® – Viaform Accelerator, Viaform Suppressor, Viaform Leveler, Analytical Standards
NExT™ Generation Viaform – Viaform NExT Leveler, Viaform V700, Viaform S900

Post CMP Cleans

Cu post-CMP cleans – ESC-700T series products
CMP buff – SP-28T
CMP pad cleans – LP-12T, ESC-700 series products
Post-post-CMP cleans – ESC-700 series products
TaN post-CMP cleans – ESC-700 series products
Dielectric Cleaning – ESC-700 series products
STI post-CMP cleans – ESC-700 series products
Pre-ECP cleans – ESC-700 series products
W-CMP Cleans – ESC-794T, ESC-774T

Dielectrics

OMTS
TEOS
TMGe
Wafer Reclaim

RegenSi™