- Technical Application Manager (w/m/d) – (GaN-Micro-LED, -Power, -RF)
- Package Development Engineer
- Integration Process Engineer
- Senior Building Services Engineer , National Semiconductor
- Ingenieure im Aussendienst oder Marketing
- Vertriebsmitarbeiter (m/w) für den Innendienst
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40406 Torenia CircleCA 94538 Fremont
Vereinigte Staaten von Amerika
Leistungen / Produkte
CMP Technology develop and markets software solutions in CMP simulation and dummy filling. It's software package CLIP is the first commercial CMP software package, and it's also the first to have been validated in real life production.
The company was founded by Dr. Kai Yang and Dr. George Liu. Together, they have over 20 years of industrial experience in engineering, engineering management and high-tech venture management. The have expertise not only in semiconductor processing such as photo-lithography, chemical mechanical polishing, but also in phase-shift mask design, interconnect parasitic extraction, layout verification, electromagnetic waves and digital signal processing.